JPH0338334U - - Google Patents
Info
- Publication number
- JPH0338334U JPH0338334U JP9711289U JP9711289U JPH0338334U JP H0338334 U JPH0338334 U JP H0338334U JP 9711289 U JP9711289 U JP 9711289U JP 9711289 U JP9711289 U JP 9711289U JP H0338334 U JPH0338334 U JP H0338334U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- terminals
- connection structure
- board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005187 foaming Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9711289U JPH0338334U (en]) | 1989-08-22 | 1989-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9711289U JPH0338334U (en]) | 1989-08-22 | 1989-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338334U true JPH0338334U (en]) | 1991-04-12 |
Family
ID=31646262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9711289U Pending JPH0338334U (en]) | 1989-08-22 | 1989-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338334U (en]) |
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1989
- 1989-08-22 JP JP9711289U patent/JPH0338334U/ja active Pending